Sealing frame and method for covering a component
US8833726B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 6, 2009 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Jun 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1469
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sealing frame for delimiting a surface of a component which is to be covered with a molding compound includes an upper frame part and a lower frame part which may be detachably joined together. The component to be covered with the molding compound is enclosable by the upper frame part and the lower frame part in such a way that a cavity is formed by the sealing frame and the component. The component is inserted into the upper frame par and lower frame part, and the upper and lower frame part are joined to form the sealing frame, so that the cavity is formed which is enclosed by the component and the upper frame part, and a molding compound is introduced into the cavity and cured to form a cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.