Bipod flexure ring
US8834056B2 · kind B2 · utility
12Cited by
44References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2012 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Oct 11, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/217
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A thermal coupling includes a first structure having a first coefficient of thermal expansion; a second structure having a second coefficient of thermal expansion lower than the first coefficient of thermal expansion; a plurality of thermal expansion fingers provided in the first structure; a plurality of thermal expansion flanges extending from the plurality of thermal expansion fingers, respectively; and a flange extending from the second structure and attached to the plurality of thermal expansion flanges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.