Method for isolating flexible substrate from support substrate
US8834655B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2009 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Dec 19, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.