Droplet manipulations on EWOD microelectrode array architecture
US8834695B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2011 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Apr 18, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2400/0427
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of manipulating droplet in a programmable EWOD microelectrode array comprising multiple microelectrodes, comprising: constructing a bottom plate with multiple microelectrodes on a top surface of a substrate covered by a dielectric layer; the microelectrode coupled to at least one grounding elements of a grounding mechanism, a hydrophobic layer on the top of the dielectric layer and the grounding elements; manipulating the multiple microelectrodes to configure a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes, comprising: a first configured-electrode with multiple microelectrodes arranged in array, and at least one second adjacent configured-electrode adjacent to the first configured-electrode, the droplet disposed on the top of the first configured-electrode and overlapped with a portion of the second adjacent-configured-electrode; and manipulating one or more droplets among multiple configured-electrodes by sequentially activating and de-activating one or more selected configured-electrodes to actuate droplets to move along selected route.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.