Patent · US Active

Method of joining dissimilar materials

US8835799B2 · kind B2 · utility

2Cited by
26References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 31, 2013
Grant dateSep 16, 2014
Priority date
Expiry dateJan 31, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49195
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method of forming a wire includes providing a first wire segment and a second wire segment. The first and second wire segments are inserted into opposite ends of a coupling segment. The coupling segment is laser welded such that the laser creates an indent in the coupling segment that penetrates into at least one of the first and second wire segments.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.