Laser cutting method and method of manufacturing organic light-emitting device
US8835803B2 · kind B2 · utility
1Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2010 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Nov 4, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.