Hybrid dielectric material for thin film transistors
US8835909B2 · kind B2 · utility
6Cited by
10References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 30, 2009 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Apr 28, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02274
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Thin-film transistors are made using an organosilicate glass (OSG) as an insulator material. The organosilicate glasses may be SiO2-silicone hybrid materials deposited by plasma-enhanced chemical vapor deposition from siloxanes and oxygen. These hybrid materials may be employed as the gate dielectric, as a subbing layer, and/or as a back channel passivating layer. The transistors may be made in any conventional TFT geometry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.