Patent · US Active

Hybrid dielectric material for thin film transistors

US8835909B2 · kind B2 · utility

6Cited by
10References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 30, 2009
Grant dateSep 16, 2014
Priority date
Expiry dateApr 28, 2030

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/02274
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Thin-film transistors are made using an organosilicate glass (OSG) as an insulator material. The organosilicate glasses may be SiO2-silicone hybrid materials deposited by plasma-enhanced chemical vapor deposition from siloxanes and oxygen. These hybrid materials may be employed as the gate dielectric, as a subbing layer, and/or as a back channel passivating layer. The transistors may be made in any conventional TFT geometry.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.