Micro device stabilization post
US8835940B2 · kind B2 · utility
203Cited by
47References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2012 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Sep 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.