Backside illumination image sensor and electronic system including the backside illumination image sensor
US8836068B2 · kind B2 · utility
1Cited by
0References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 12, 2011 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | May 12, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
A backside illumination image sensor, a method of fabricating the same, and an electronic system including the backside illumination image sensor, the backside illumination image sensor including a semiconductor substrate, the semiconductor substrate having an upper surface and a lower surface; photodiodes in the semiconductor substrate; and metal interconnections below the semiconductor substrate, wherein each of the photodiodes includes a N-type region, a lower P-type region below the N-type region, and an upper P-type region on the N-type region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.