Positive photosensitive resin composition, method of creating resist pattern, and electronic component
US8836089B2 · kind B2 · utility
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2References
22Claims
0Family size
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Key dates
| Filing date | Sep 2, 2011 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Sep 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.