Image capture lens module and wafer level packaged image capture devices
US8837060B2 · kind B2 · utility
6Cited by
4References
20Claims
0Family size
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Inventors
Key dates
| Filing date | Feb 25, 2011 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Jun 21, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Image capture lens modules and wafer level packaged image capture devices are presented. The image capture lens module includes a compound lens with a first lens element and a second lens element molded on both sides of a substrate, and a field stop disposed at an interface between the first lens element and the substrate or at an interface between the second lens element and the substrate, wherein the field stop is a coating layer with a polygonal transparent area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.