Metallic housing, method for making the same and electronic device using the same
US8837123B2 · kind B2 · utility
2Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2011 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | May 19, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/129
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A metallic housing for an electronic device, the metallic housing includes a main body defining a receiving chamber for receiving electronic components and an opening communicating with the receiving chamber, and a covering plate positioned on the main body adjacent to a side of the main body. The covering plate is welded to the main body by friction stir welding and a welded region is formed on a side surface of the metallic housing such that the welded region is smooth with the main body and the covering plate. A method for making the metallic housing and an electronic device using the metallic housing is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.