Memory modules including compliant multilayered thermally-conductive interface assemblies
US8837151B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2011 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Nov 15, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.