Electronic package structure
US8837168B2 · kind B2 · utility
3Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2013 |
| Grant date | Sep 16, 2014 |
| Priority date | — |
| Expiry date | Jan 31, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.