Patent · US Active

Method for gluing heat-activated glueable surface elements

US8840748B2 · kind B2 · utility

1Cited by

4References

19Claims

0Family size

Assignee

tesa SE · DE

Inventors

Anja Staiger · Hamburg, DE
Klaus Keite-Telgenbüscher · Hamburg, DE
Judith Grünauer · Hamburg, DE
Hans Karl Engeldinger · Quickborn, DE

Key dates

Filing date	Oct 8, 2010
Grant date	Sep 23, 2014
Priority date	—
Expiry date	Oct 8, 2030

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29K2995/0008
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method glues a heat-activated glueable surface element to an adhesive substrate which does not conduct electric current, whereby a surface thereof has only a low thermal conductivity. The heat-activated glueable surface element has an electrically conductive layer in addition to a heat-activated adhesive mass. The layer is inductively heated for a short time in an alternating magnetic field at a frequency from a middle frequency range. A high pressure of at least 1 MPa is exerted on the gluing surface simultaneously to the inductive heating, whereby preventing thermal decomposition reactions is possible. Further, a device performs the method and has an induction heater integrated in a press tool.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.