Method for manufacturing printed circuit board including flame retardant insulation layer
US8840967B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2011 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Jun 6, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.