Backplane slot interconnection system, method and apparatus
US8841560B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 4, 2011 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Oct 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/044
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Herein disclosed are an apparatus, a system and a method, selectively linking signals between or among slots on a backplane. A backplane printed circuit board has defined slots, each of which receives a card or module. One or more arrays of solder ball mounting pads correspond to signal lines of the slots. Each of one or more signal mapping overlay printed circuit boards has at least one signal trace connected to solder ball landing pads. Selected solder ball mounting pads of the backplane printed circuit board are connected to selected solder ball landing pads of the signal mapping overlay printed circuit board by solder balls. The signal trace or traces of the signal mapping overlay printed circuit board or boards connect the corresponding selected signal lines between or among the slots of the backplane. The backplane and signal mapping overlay printed circuit boards may have mirrored connection arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.