Integrated circuit with MEMS element and manufacturing method thereof
US8841736B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2013 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Aug 6, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An integrated circuit comprising a MEMS (microelectromechanical system) element in a plane of the integrated circuit, the MEMS element being suspended in a cavity over a substrate, said cavity including a first cavity region in said plane spatially separating an edge of the MEMS element from a wall section, said edge being arranged to be displaced relative to the wall section; and a second cavity region in said plane forming part of a fluid path further including the first cavity region, said fluid path defining a first volume; and a third cavity region in said plane defining a second volume in fluid connection with the second cavity region, wherein the maximum width of the second cavity region is larger than the maximum width of the third cavity region, the second and third cavity regions having maximum widths that are larger than the maximum width of the first cavity region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.