Semiconductor device including a first wiring having a bending portion a via
US8841774B2 · kind B2 · utility
2Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2013 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Mar 7, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first wiring (1) has a bending portion (2), a first wiring region (1a) extending from the bending portion (2) in the X direction, and a second wiring region (1b) extending from the bending portion (2) in the Y direction. A via (3) is formed under the wiring (1). The via (3) is formed so as not to overlap with a region of the bending portion (2) in the first wiring region (1a). The length of the via (3) in the X direction (x) is longer than the length thereof in the Y direction (y) and both ends of the via (3) in the Y direction overlap with both ends of the first wiring region (1a) in the Y direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.