Packaged microphone with reduced parasitics
US8842859B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2012 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Mar 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A packaged microphone has a base with a top face, a lid coupled to the base and forming an interior, and a MEMS microphone (i.e., a die or chip) secured to the top face of the base within the interior. The packaged microphone also includes a circuit chip secured to the top face of the base within the interior. The circuit chip has a top surface with a top pad, a bottom surface with a bottom pad, and a via. The bottom pad is electrically connected to the base, and the via electrically connects the top pad with the bottom pad. A wire bond is connected between the MEMS microphone and the top pad on the circuit chip. The MEMS microphone is electrically connected to the bottom pad and the base through the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.