Pattern forming method and pattern forming apparatus
US8845077B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Mar 14, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A pattern forming method includes: a modification treatment step of, in accordance with a pattern to be formed on a pattern forming surface of a base body, applying a light beam having a width smaller than a diameter of each of dots to constitute the pattern, onto a treatment target region including at least outer edges on both sides in a width direction of a region where the pattern is to be formed in the pattern forming surface, thereby carrying out modification treatment on the treatment target region; and a droplet deposition step of ejecting and depositing droplets of a functional liquid by an inkjet method onto the region where the pattern is to be formed including the treatment target region where the modification treatment has been carried out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.