Alignment method, imprint method, alignment apparatus, and position measurement method
US8845317B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2007 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | May 1, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7088
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An imprint apparatus for performing alignment between a mold and a substrate and imprinting a pattern of the mold to a layer of the substrate. A holder holds the mold. A stage holds the substrate opposite to the mold held by the holder. A microscope, including an image pickup device, detects a first alignment mark formed in the mold, via a first image pickup area of the image pickup device, and detects a second alignment mark formed in the substrate, via a second image pickup area of the image pickup device. The first and second image pickup areas do not overlap with each other. A contrast of signals obtained by the image pickup device is adjusted with respect to each of the first and second image pickup areas, and the alignment is performed by changing relative positions of the holder and the stage based on first information about a deviation of the detected first alignment mark from a predetermined position in the first image pickup area and second information about a deviation of the detected second alignment mark from a predetermined position in the second image pickup area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.