Method for manufacturing circuit board using electrically conductive particles and circuit board manufactured by the method
US8845842B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 29, 2011 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Aug 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An exemplary method for manufacturing a circuit board includes, firstly, obtaining an insulating substrate, liquid heat-curable adhesive and electrically conductive particles. The electrically conductive particles are added into the liquid heat-curable adhesive. The electrically conductive particles in the heat-curable adhesive are activated by electrical discharge. Secondly, the liquid heat-curable adhesive having activated electrically conductive particles are spread on the insulating substrate to form a heat-curable adhesive layer on the insulating substrate. Thirdly, the heat-curable adhesive layer are exposed to the mid-infrared light by using a photo-mask, the photo-mask has a pattern corresponding to a desired circuit pattern of the circuit board. The electrically conductive particles relocated themselves one by one to form the circuit pattern under irradiation by the mid-infrared light. Finally, the heat-curable adhesive layer are hardening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.