Patent · US Active

Vacuum lamination system and vacuum lamination method

US8845844B2 · kind B2 · utility

2Cited by
2References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 7, 2012
Grant dateSep 30, 2014
Priority date
Expiry dateNov 7, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/12
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A vacuum lamination system and a vacuum lamination method are provided in which, when a laminate film and laminate base items are laminated and an excessive portion of the laminate film is cut from the laminated item having the laminate film laminated thereon, a high precision lamination is enabled and the cutting process including a conveying device for cutting the excessive portion of the laminate film can be simplified. In the vacuum lamination system, a laminate film and laminate base items that are conveyed on the carrier film are laminated by the batch type vacuum laminating device, and the laminate film is cut from the laminated item having the laminate film laminated thereon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.