Systems and methods for cleaving a bonded wafer pair
US8845859B2 · kind B2 · utility
5Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2012 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Nov 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.