Surface-mount light emitting device
US8846420B2 · kind B2 · utility
3Cited by
17References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2013 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Aug 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
Abstract
A surface-mount light emitting device is provided comprising a light emitting element (2), a reflector (1) which is molded integral with a leadframe (11, 12) having the light emitting element mounted thereon, and an encapsulating resin composition (4). The reflector is molded from a heat curable resin composition to define a recess with bottom and side walls. The resin side wall has a thickness of 50-500 μm. The encapsulating resin composition is a heat curable resin composition having a hardness of 30-70 Shore D units in the cured state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.