Process for CMP with large feature size variation
US8846534B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2011 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | May 15, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention relate to reducing the size variation on a wafer fabrication. In some embodiments, at least a portion the backfill material over features larger than a threshold size is etched or milled to provide backfill protrusions over those features. The backfill protrusions are configured to reduce the size variation across the fabrication. Embodiments of the invention may be used in fabrication of many types of devices, such as tapered wave guides (TWG), near-field transducers (NFT), MEMS devices, EAMR optical devices, optical structures, bio-optical devices, micro-fluidic devices, and magnetic writers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.