Soluble terminally modified imide oligomer using 2-phenyl-4, 4′-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance
US8846552B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 3, 2009 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Sep 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/69
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A novel terminally modified imide oligomer having excellent solubility in organic solvents, excellent solution storage stability, and excellent molding properties such as low melt viscosity. Also, a varnish obtained by dissolving the terminally modified imide oligomer in an organic solvent; a cure product obtained by using the terminally modified imide oligomer and having excellent thermal and mechanical characteristics such as heat resistance, elastic modulus, tensile strength at break and tensile elongation at break; a prepreg; and a fiber-reinforced laminate. The soluble terminally modified imide oligomer is represented by general formula (1). In the formula, R1 and R2 each represents a divalent aromatic diamine residue; R3 and R4 each represents a tetravalent aromatic tetracarboxylic acid residue; R5 and R6 each represents a hydrogen atom or a phenyl group, with R5 or R6 being a phenyl group; m and n satisfy the following relations: m≧1, n≧0, 1≦m+n≦20 and 0.05≦m/(m+n)≦1; and the repeating units may be arranged in blocks or randomly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.