Method and device for machining a workpiece

US8847109B2 · kind B2 · utility

Assignee

• SAUER GMBH LASERTEC · DE

Inventors

• Michael Kuhl · Hafenhofen, DE
• Peter Hildebrand · Pfronten, DE
• Martin Reisacher · Kempten, DE

Key dates

• Filing date: Mar 17, 2009
• Grant date: Sep 30, 2014
• Expiry date: Jun 9, 2032

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/082
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

In a method for machining a workpiece, a laser beam (5) is guided across the workpiece surface by means of a beam guide (2, 51), wherein the laser beam guide comprises a first guide (2) effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide (51) simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.