CMOS compatible MEMS microphone and method for manufacturing the same
US8847289B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2010 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Jul 28, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A CMOS compatible MEMS microphone is disclosed. In one embodiment, the microphone comprises an SOI substrate, wherein a CMOS circuitry is accommodated on its silicon device layer; a microphone diaphragm formed with a part of the silicon device layer, wherein the microphone diaphragm is doped to become conductive; a microphone backplate including CMOS passivation layers with a metal layer sandwiched and a plurality of through holes, provided above the silicon device layer, wherein the plurality of through holes are formed in the portion thereof opposite to the microphone diaphragm, and the metal layer forms an electrode plate of the backplate; a plurality of dimples protruding from the lower surface of the microphone backplate opposite to the diaphragm; and an air gap provided between the diaphragm and the microphone backplate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.