Heat dissipation system
US8848363B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 3, 2011 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | May 20, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.