Distributed RSVP-TE in a multi-chassis node architecture
US8848712B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2009 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Apr 1, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2011/0039
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A network device includes a multi-chassis system in which each chassis includes a RSVP-TE protocol stack that may provide RSVP-TE services for LSP tunnels associated with each chassis. The multi-chassis system may include an administrative chassis. The administrative chassis may forward RSVP messages to other chassis of the network device. The administrative chassis may encapsulate the RSVP messages with a chassis address. The other chassis may de-encapsulate the RSVP messages and process the RSVP messages according to the RSVP-TE protocol. The administrative chassis may obtain session information associated with other chassis based on RSVP messages received. The administrative chassis may manage adjacency mechanisms and failure and recovery mechanisms. The multi-chassis system including the distributed RSVP-TE protocol stacks may minimize scalability issues and improve performance when high-capacity routing and/or switching services are needed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.