Integrated conductive sensor package having conductor bypass, distal electrode, distal adapter and custom molded overlay
US8849424B2 · kind B2 · utility
0Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2009 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Feb 2, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49982
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
This disclosure relates to implantable medical devices (IMDs); in particular, to medical electrical leads having an integrated sensor disposed in a hermetic package and said sensor package accommodates a torque coil and an elongated cable conductor extending therethrough. The integrated sensor can include a pressure sensor, an accelerometer, and the like. The coil and the cable can couple to pacing and sensing electrode coupled to the lead distal to the sensor package. The sensor package is compact, substantially circular in cross section and robust, in that the overall design promote mechanical stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.