Techniques to predict three-dimensional thermal distributions in real-time
US8849630B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2008 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Jun 18, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Techniques for monitoring and predicting environmental operating conditions in a data center are provided. In one aspect, a method for real-time, three-dimensional analysis of environmental operating conditions in a data center includes the following steps. High spatial resolution three-dimensional measurements of one or more environmental variables in the data center made at a time t1 are obtained. Real-time measurements of the environmental variables in the data center made at a time t2, wherein t2 is later in time than t1, are obtained. The high spatial resolution three-dimensional measurements are combined with the real-time measurements to derive a model for the environmental variables in the data center at the time t2. The model is used to predict three-dimensional distributions of the environmental variables in the data center at the time t2. A base model can be created and used to derive the model for the data center at the time t2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.