Method of forming a land grid array with discrete pads
US8850699B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2011 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Aug 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A land grid array (LGA) and a method of forming the LGA are disclosed. The method comprises plating a printed circuit board to form a grid array of copper pads, and soldering a discrete pad over each of the plated copper pads in the grid array. The discrete pad is a solid object that can be handled and positioned independent of other discrete pads. Optionally, the method may further comprise measuring variations in flatness of the printed circuit board as a function of location in the grid array, and selecting individual discrete pads that each have a thickness selected for use at a particular location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.