Method for manufacturing multilayer printed circuit board having mounting cavity
US8850701B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Dec 23, 2011 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | May 22, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1057
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a multilayer PCB comprises the following steps. First, a PCB substrate includes a first circuit layer is provided. The first circuit layer includes a mounting portion. A first solder-resistant layer is formed on the mounting portion and a protective adhesive film is attached on the first solder-resistant layer. Next, a first copper foil, a first adhesive layer, a second copper foil, and a second adhesive layer are laminated on the PCB substrate, and the first and second copper foils are etched to form circuit layers. Then a cavity is defined and the protective adhesive film is exposed in it. After removing the protective adhesive film, an electronic component is mounted in the cavity. As such, a multilayer PCB with the electronic component embedded in is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.