Card lamination
US8851385B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2013 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Apr 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/50
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Described herein are RFID structures and methods of manufacturing RFID structures. An antenna substrate is provided. A first stack layer is provided. An antenna assembly including an antenna track, and at least two contact pads, are formed on a first surface of the antenna substrate. An integrated circuit unit is coupled to the at least two contact pads. A first surface of the first stack layer, the first surface of the antenna substrate, or both are coated with a unidirectional thermally expansive coating material. The first surface of the antenna substrate is positioned to be adjacent to the first surface of the first stack layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.