Method of bonding a metal to a substrate
US8852359B2 · kind B2 · utility
8Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2011 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Aug 19, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C6/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of bonding a metal to a substrate involves forming an oxide layer on a surface of the substrate, and in a molten state, over-casting the metal on the substrate surface. The over-casting drives a reaction at an interface between the over-cast metal and the oxide layer to form another oxide. The other oxide binds the metal to the substrate surface upon solidification of the over-cast metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.