Low-stress molded gasket and method of making same
US8852486B2 · kind B2 · utility
4Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2007 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Aug 16, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16L23/18
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A molded discrete low stress gasket is constructed of restructured filled PTFE for use in corrosive or severe chemical environments under relatively low bolt loads. The gasket has a gasket surface and includes a raised outer sealing ring and a raised inner sealing ring. The gasket may constructed from a restructured filled PTFE material, with the sealing rings deforming at lower pressures than the remaining portions of the gasket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.