Method and apparatus of electrical field assisted imprinting
US8852494B2 · kind B2 · utility
1Cited by
3References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2007 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Feb 21, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/568
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for performing nanoimprint lithography. When an electric field is applied between the mold and the substrate, various forces can be generated among molds, substrates, and resists. The electrostatic force between the mold and the substrate can serve as an imprinting pressure to press the structured mold into the conformable resist. In addition, the electric field induces additional wetting forces (electrowetting or dielectrophoresis) in a liquid resist, which can assist the flow and filling of the liquid resist into fine structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.