Plasma reactor for abating hazardous materials and driving method thereof
US8852520B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2010 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Dec 19, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention provides a plasma reactor for abating hazardous materials generated in a low-pressure process during a process of manufacturing a display or a semiconductor. A plasma reactor for abating hazardous materials according to an exemplary embodiment of the present invention includes: a first ground electrode and a second ground electrode disposed at a distance from each other; a dielectric fixed between the first ground electrode and the second ground electrode; and at least one driving electrode disposed on an outer surface of the dielectric, being spaced apart from the first ground electrode and the second ground electrode and connected to an AC power supply unit to receive a driving voltage therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.