Packaging formed from a butt-welded film
US8852705B2 · kind B2 · utility
1Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2007 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Jul 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24488
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Packaging produced from a thermoplastic film of which the ends are placed so that they abut, said film being composed of several layers, including at least a first weldable layer and a second layer of which the butt-welding is only partial or non-existent, and at least one thin strip covering said ends and being directly attached to one of the faces of the second layer, the difference in the melting point between the first layer and the other layer or layers being greater than 20° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.