Patent · US Active

Melt-extruded substrate for use in thermoformed articles

US8852730B2 · kind B2 · utility

7Cited by
108References
29Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 27, 2012
Grant dateOct 7, 2014
Priority date
Expiry dateSep 12, 2032

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09K2019/0481
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A melt-extruded substrate that can be readily thermoformed into a shaped, three-dimensional article is provided. The substrate is formed from a polymer composition that contains a thermotropic liquid crystalline polymer and a unique aromatic amide oligomer. The present inventors have discovered that the oligomer can help increase the “low shear” complex viscosity of the resulting polymer. The ability to achieve enhanced low shear viscosity values can lead to polymer compositions with an increased melt strength, which allows the resulting substrate to better maintain its shape during thermoforming without exhibiting a substantial amount of sag. Due to its relatively high degree of melt strength, the polymer composition is particularly well suited for forming thin extruded substrates for use in thermoforming processes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.