Thermoset compositions from plant polyphenols
US8853343B1 · kind B1 · utility
5Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2013 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | May 1, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process and thermoset resin structures having: number of —OCNs attached to phenyl rings exceeds number of phenyl rings (provides glass transition temperature of 334° C. when combined with flexible bridge); bridge between rings does not hinder rotation and allows maximum rotational degrees of freedom (allows complete cure at temperatures less than 350° C.); and bridge between rings is small enough to maintain cyanurate density and allows for high char yields.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.