Bonding structure
US8853555B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2013 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Mar 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0228
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bonding structure includes a substrate, multiple first pads, multiple second pads, an insulation layer and a patterned conductive layer. The substrate has a bonding region and a predetermined-to-be-cut region. The first pads are disposed on the substrate and within the bonding region. The second pads are disposed on the substrate and within the predetermined-to-be-cut region. The insulation layer is disposed on the substrate and covers the first and second pads. The insulation layer has multiple first and second openings respectively exposing parts of the first and second pads. The patterned conductive layer is disposed on the substrate and covers the insulation layer and the parts of the first and second pads exposed out by the first and second openings, in which the patterned conductive layer is electrically connected to the first and second pads via the first and second openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.