Curable epoxy resin composition
US8853734B2 · kind B2 · utility
1Cited by
0References
18Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 21, 2011 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Aug 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are: a curable epoxy resin composition including an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by following Formula (1) where each of R1s and R2 represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and a curing agent (C) or curing catalyst (D); and a cured article obtained through curing of the curable epoxy resin composition. The alicyclic epoxy compound (A) preferably has cyclohexene oxide group as the alicyclic epoxy group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.