Vertically integrated systems

US8853799B2 · kind B2 · utility

Assignee

• Analog Devices, Inc. · US

Inventors

• Alan J. O'Donnell · Limerick, IE
• Santiago Iriarte · Limerick, IE
• Mark J. Murphy · Livonia, US
• Colin G. Lyden · Baltimore, IE
• Gary Casey · Tarbert, IE
• Eoin Edward English · Pallasgreen, IE

Key dates

• Filing date: Sep 30, 2013
• Grant date: Oct 7, 2014
• Expiry date: Sep 30, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E70/30
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.