Bonding on silicon substrate having a groove
US8853915B2 · kind B2 · utility
0Cited by
5References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2009 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | May 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
Abstract
A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.