Sensor assembly and method of measuring the proximity of a machine component to a sensor
US8854052B2 · kind B2 · utility
2Cited by
59References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 22, 2010 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Jun 1, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B15/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microwave sensor assembly includes a signal processing device for generating at least one microwave signal that includes a pattern of frequencies and at least one probe coupled to the signal processing device. The probe includes an emitter configured to generate an electromagnetic field from the at least one microwave signal, wherein the emitter is detuned when an object is positioned within the electromagnetic field such that a loading signal is reflected from the emitter to the signal processing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.