On-package multiprocessor ground-referenced single-ended interconnect
US8854123B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2013 |
| Grant date | Oct 7, 2014 |
| Priority date | — |
| Expiry date | Jul 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L25/0292
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A system of interconnected chips comprising a multi-chip module (MCM) includes a first processor chip, a second processor chip, and an MCM package configured to include the first processor chip, the second processor chip, and an interconnect circuit. The first processor chip is configured to include a first ground-referenced single-ended signaling (GRS) interface circuit. A first set of electrical traces fabricated within the MCM package and configured to couple the first GRS interface circuit to the interconnect circuit. The second processor chip is configured to include a second GRS interface circuit. A second set of electrical traces fabricated within the MCM package and configured to coupled the second GRS interface circuit to the interconnect circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.